1. Intelligent temperature control
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
Specification:
| General |
| Compatible with |
Apple: iPhone 12, iPhone 12 Pro Max, iPhone 12 Pro, iPhone 12 mini, iPhone 11 Pro, iPhone 11 Pro Max, iPhone 11, iPhone XS, iPhone XR, iPhone XS Max, iPhone X
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| Package Weight |
| One Package Weight |
0.98kgs / 2.16lb |
| One Package Size |
23cm * 17cm * 7cm / 9.06inch * 6.69inch * 2.76inch |
| Carton Weight |
20.40kgs / 44.97lb |
| Carton Size |
48cm * 36cm * 37cm / 18.9inch * 14.17inch * 14.57inch |
| Loading Container |
20GP: 417 cartons * 20 pcs = 8340 pcs 40HQ: 968 cartons * 20 pcs = 19360 pcs
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