3D Printer Heated Bed Power Expansion Module MOSFET Board for ANET A8 3D Printer

1. The hot bed high-power expansion module has a compact appearance and stronger heat dissipation, which can solve the problem of excessive heating bed power and current load.
2. Under normal heat dissipation, this module can work stably for a long time when the measured I (Max) is equal to 30A. During use, the current should not exceed 30A.
3. When using a hot bed with a power greater than 150W, please connect an external high-power module
4. Easy to use
5. Delivery list: high-power module, motherboard PWM 20CM signal control line, high-power module 30cm power supply wiring (2 red and black)