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1. Model-S is used to pry the CPU IC hard disk.
2. Model-E is used to remove glue from the IC CPU of the mobile phone motherboard.
3. Model-X professional edge glue removal tool.
4. Model-Y cuts the black glue without damaging the board.
5. Anti-slip and labor-saving design, ergonomic, comfortable grip.
2. Model-E is used to remove glue from the IC CPU of the mobile phone motherboard.
3. Model-X professional edge glue removal tool.
4. Model-Y cuts the black glue without damaging the board.
5. Anti-slip and labor-saving design, ergonomic, comfortable grip.
Specification:
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